2017考研英语拓展阅读：中国加码布局半导体市场
考研英语阅读能力提升需要不断地积累练习，通过阅读来积累词汇量，提升阅读速度和理解能力。暑期强化复习，阅读强度要加大，新东方在线继续分享一些有关政治、经济、文化、生活、体育、科技等方面的文章，大家要多多拓展。下面一篇文章是关于中国加码布局半导体市场。2017考研英语拓展阅读：中国加码布局半导体市场
China created the country’s largest chip maker last week, taking a giant
step forward towards Beijing’s plan of becoming less reliant on foreign
technology.
上周中国产生了境内最大的芯片制造商，离中国政府减少对国外科技依赖的目标前进了一大步。
Under Beijing’s direction, Tsinghua Unigroup, China’s largest chip
designer, acquired a majority stake in XMC, one of the China’s leading chip
maker and backed by the national semiconductor fund, the Wall Street Journal
reported. A new holding company was created for XMC called Yangtze River Storage
Technology, which has a registered capital of 18.9 billion yuan ($2.8
billion).
据华尔街日报报道，在政府的授意下，清华紫光集团完成收购武汉新芯多数股权，成立新控股公司“武汉长江存储科技有限公司”，注册资金高达189亿人民币(28亿美元)。清华紫光是中国大陆最大的芯片设计商而武汉新芯则是行业领先的芯片制造商背后还有国家集成电路产业投资基金的扶持。
Yangtze combines Tsinghua Unigroup’s investment power and XMC’s engineering
team, said Roger Sheng, a Shanghai-based research director for semiconductors at
Gartner IT , adding that the merger is the first case between two Chinese
companies in the semiconductor industry.
武汉长江存储科技有限公司整合了清华紫光的投资能力和武汉新芯的技术团队。高德纳咨询(全球最具权威的IT研究与顾问咨询公司)上海公司总监Roger
Sheng表示两个中国本土企业合并在半导体制造业尚属首例。
China imports around $200 billion of chips a year, which is the biggest
trade deficit in the global semiconductor market, according to state-run Xinhua
news agency. The creation of Yangtze would indeed benefit the country in the
long run, but it will first have a negative impact on the smaller domestic
players, said Sheng.
按照新华社的说法，中国每年进口芯片的费用高达200亿美元，是全球半导体市场中最大的贸易逆差。从长远来看，武汉长江存储科技有限公司的成立有利于中国在该行业的发展但是首当其冲受到影响的是中国国内规模比较小的芯片制造商。
“Currently, I think other Chinese companies that want to invest in the
memory business are most impacted because the new company will get the most
resources and support from the Chinese government,” he said. “The other
companies or regional governments can’t get as big an investment as
Yangtze.”
Roger
Sheng接着说：“我认为想要投资存储行业的国内企业受到的冲击应该最严重，因为武汉长江存储将会垄断大部分的资源而且还有政府的支持。其他制造商或是地方企业不可能获得像长江存储那么大的投资。”
Global chip makers are safe for at least a few years, with Yangtze needing
at least two to three years to get commercialization capability, unless Tsinghua
Unigroup can acquire companies with current mainstream 3D NAND (a
next-generation flash memory chip) or DRAM (computer memory chips), said
Sheng.
“全球性的芯片制造商暂时不会受到大的影响，因为武汉长江存储至少需要两到三年的时间培养商业化的能力，除非清华紫光可以并购拥有目前主流的3D
NAND闪存技术和DRAM存储技术的企业。”
XMC, however, is developing today’s leading-edge 3D NAND chips to be
test-ready by the end of this year, said Hui He, a senior analyst for China’s
semiconductor market at IHS Technology. The company will have more advanced
chips for initial mass production scheduled for the first half of 2018, she
said.
咨询公司 IHS 负责半导体行业的资深分析师何辉(音译)说，但是目前武汉新芯已经在研制高水平3D
NAND闪存芯片，即将在今年年末投入测试。到2018年上半年就可以投入批量生产。
After the proven product ramp-up period, “all global memory vendors will be
affected,” said Gartner’s Sheng. “Chinese companies could own the market with
proven product manufacturing capabilities. It will definitely impact existing
market players through cheaper and volume product supply.”
Roger
Sheng说：“在爬坡量产过后，全球的存储芯片供应商都会受到影响。届时，中国企业将拥有过硬的产品生产能力，有能力向市场提供更多，更便宜的产品。毫无疑问，目前半导体芯片市场的主要制造商一定会受到冲击。”
Some of the global chip makers whose market shares will be affected are
South Korea’s SK Hynix, Japan’s Toshiba , U.S.’s Micron (which Tsinghua Unigroup
tried and failed to buy for $23 billion because of national security risk), as
well as Intel INTC, which has a plant in Dalian, China, that started 3D NAND
production just last month, said IHS’ Hui.
何辉表示到时候韩国海力士，日本东芝，美国美光(清华紫光曾拟230亿美元收购美光最后因为信息安全顾虑作罢)以及因特尔等世界级芯片制造商的市场份额都会受到影响。上个月因特尔才开始在中国大连的分厂开始生产3D
NAND闪存产品。
Samsung, which released its earnings for the second quarter last week and
said it expects its semiconductor business to drive the conglomerate’s profit
next year, will also be affected.
上周刚刚公布二季度财报的三星希望借半导体存储业务提振公司业绩，估计这一愿望也将缩水。
XMC is currently the only Chinese enterprise working on 3D NAND technology,
and will be able to ship some products to the market with Tsinghua Unigroup’s
capital support up until 2020, said Hui. By 2030, XMC targets to be a tier-one
3D NAND supplier, she added.
何辉表示武汉新芯是目前唯一有能力生产 3D NAND闪存的中国企业，现在又有了清华紫光的资本助力，到2020年就可以有3D
NAND闪存的产品上市。同时她还补充说，武汉新芯的目标是到2030年挤身3D NAND生产商的第一梯队。
Though China’s Yangtze River Storage Technology has the investment power
and engineering team to improve the country’s memory technology, “the biggest
obstacle of the Chinese memory industry is still how to get matured memory
technologies from major memory players,” said Gartner’s Sheng.
Roger
Sheng说虽然武汉长江存储既有投资资本又有技术团队保驾护航，助力中国的存储芯片市场，但是目前它面临的最大问题还是如何从主流的存储芯片制造商那里获取成熟的存储技术。
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